Broadcom (AVGO) is arranging more than $50 billion to finance OpenAI's chips

Broadcom logo with the text: Arranging $50 billion+ to finance OpenAI's chips

Key points

  • Broadcom wants to arrange more than $50 billion for OpenAI's chips
  • Apollo and Blackstone are among the lenders it has approached
  • Broadcom is also arranging financing for Anthropic

Broadcom (AVGO) is seeking more than $50 billion in financing for the custom AI chips it's building for OpenAI, The Wall Street Journal reported on October 7. Apollo Global Management (APO) and Blackstone (BX) are among the lenders Broadcom has approached.

The proposed OpenAI financing could cover several gigawatts of computing capacity, with a deal expected before year-end. Talks remain preliminary, and the amount could change.

Apollo and Blackstone already work with Broadcom. The three companies set up the AI XPV Platform in June. Broadcom said it is designed to enable more than 20 gigawatts of computing built on its custom chips for frontier AI labs, including Anthropic and OpenAI, through 2028. It launched with a $35 billion deal led by Apollo for Anthropic.

Broadcom has also been arranging $60 billion in debt to help Anthropic and other companies pay for AI chips. Anthropic's IPO prospectus shows Broadcom agreeing to lend it up to $42 billion for computing built on Broadcom-designed chips. Reports haven't said whether that loan overlaps with the $60 billion package.

The chips come from a 10-gigawatt deal signed last year

OpenAI and Broadcom announced a collaboration on October 13, 2025, for 10 gigawatts of custom AI accelerators. OpenAI designs the chips and systems, which are developed and deployed in partnership with Broadcom in racks built with its Ethernet and other networking gear. Deployments were targeted to start in the second half of 2026 and finish by the end of 2029.

The financing push comes as OpenAI tries to own more of its computing to lower costs and rely less on cloud providers. OpenAI is also in talks to raise $30 billion in new equity at a valuation of about $1.4 trillion.

Oracle and SpaceX are lining up chip debt too

Oracle (ORCL) is negotiating with Apollo and Goldman Sachs (GS) on financing to buy chips for a 1-gigawatt data center, according to the same report. Private investors would fund a separate entity that buys the chips and leases them to Oracle.

SpaceX (SPCX) has been talking to lenders about $40 billion in debt to buy Nvidia (NVDA) chips.

Broadcom shares were at $370.33 shortly after the open at 9:31 a.m. ET on October 8, down 1.6% from the previous close.

Frequently asked questions

How much financing is Broadcom seeking for OpenAI's chips?

More than $50 billion, The Wall Street Journal reported on October 7, 2026. The financing could cover several gigawatts of computing capacity, with a deal expected before year-end. Talks are preliminary, and the amount could change.

Which lenders has Broadcom approached?

Apollo Global Management and Blackstone are among them. Both are anchor investors in the AI XPV Platform that Broadcom set up in June 2026, which Broadcom said is designed to enable more than 20 gigawatts of computing on its custom chips for frontier AI labs, including Anthropic and OpenAI, through 2028.

What is the OpenAI and Broadcom chip deal?

OpenAI and Broadcom announced a collaboration on October 13, 2025, for 10 gigawatts of custom AI accelerators designed by OpenAI and developed and deployed in partnership with Broadcom. Deployments were targeted to start in the second half of 2026 and finish by the end of 2029.

Is Broadcom financing chips for other AI companies?

Yes. Broadcom has been arranging $60 billion in debt to help Anthropic and other companies pay for AI chips, and Anthropic's IPO prospectus shows Broadcom agreeing to lend it up to $42 billion. Reports haven't said whether that loan overlaps with the $60 billion package.

More on AVGO and APO

Dennis Singleton
Dennis Singleton

Dennis Singleton was born in Australia and later moved to the United States. He has spent years following the markets, but what keeps his attention is how AI is built. He writes about the companies behind the technology, from semiconductor designers and advanced packaging to photonics, memory, networking, and the hardware powering modern AI. His approach starts with filings, earnings, and industry research, then translates the important details into clear, straightforward analysis without unnecessary hype.