Applied Materials (AMAT) expands Intel (INTC) AI chip partnership at research center already joined by TSMC

Applied Materials and Intel logos with the text Expanding AI chip R&D

Key points

  • Applied Materials and Intel are expanding their AI chip research
  • The work includes Intel's Foveros 3D chip stacking
  • TSMC is already a partner at the same Applied center

Applied Materials (AMAT) and Intel (INTC) will work together on next-generation transistors, chip wiring, and advanced packaging for AI chips, Applied announced on Oct. 6. The goal is to get new chipmaking technology from the lab into high-volume manufacturing faster.

The work will run at Applied's new EPIC Center in Silicon Valley and at Intel's research campus in Hillsboro, Oregon. Applied's release didn't include any dollar figures.

The partnership covers Intel's 3D chip stacking

The two companies will work on materials, processes, and chip designs for advanced manufacturing nodes aimed at AI workloads. That includes interconnects, the tiny wiring that links a chip's parts. They're also developing packaging technology for Foveros, Intel's method of stacking chips on top of each other, with a focus on denser connections, better power delivery, and better heat handling.

"Applied Materials is an important partner, and we look forward to expanding our work together at the EPIC Center to help accelerate the path from the lab to high-volume manufacturing in the United States," Intel CEO Lip-Bu Tan said. Applied CEO Gary Dickerson pointed to the companies' "decades-long history of deep collaboration."

Applied says the EPIC Center, short for Equipment and Process Innovation and Commercialization, is scheduled to be operationally ready this year. Applied called Intel a founding partner of the center.

Intel is part of a growing list of EPIC partners

Applied has announced three EPIC partnerships or expansions in about a week. Japanese memory maker Kioxia joined on Sept. 29, followed by an expanded partnership with Dutch packaging equipment maker Besi on Oct. 1. TSMC (TSM) joined in May.

The TSMC connection interests me most. Intel and TSMC compete to manufacture chips for other companies, and Applied works with both. Applied says those relationships help it understand what chipmakers need next and decide where to focus its own research spending.

Applied shares traded at $547.00 at 9:16 a.m. ET on Oct. 6, up about 0.9% in premarket trading. Intel was up about 0.8% at $117.10.

Our guide to what each chip equipment stock actually sells explains where Applied fits in the chipmaking process.

Frequently asked questions

What are Applied Materials and Intel working on together?

Applied Materials said on Oct. 6, 2026, that it is working with Intel on next-generation transistors, interconnects, and advanced packaging for AI chips, including packaging for Intel's Foveros 3D stacking. The work spans Applied's EPIC Center in Silicon Valley and Intel's R&D campus in Hillsboro, Oregon.

What is Applied Materials' EPIC Center?

The EPIC (Equipment and Process Innovation and Commercialization) Center is an Applied Materials research facility in Silicon Valley designed to shorten the time it takes to move new chip technologies from research into high-volume manufacturing. Applied says it is scheduled to be operationally ready in 2026.

Which companies have partnered at the EPIC Center?

Partners Applied has announced include TSMC in May 2026, Kioxia on Sept. 29, 2026, and Besi on Oct. 1, 2026. Applied called Intel a founding partner of the center in its Oct. 6, 2026, announcement.

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David Han
David Han

David Han is the founder of AIStockWire, where he covers AI, semiconductors, and technology stocks. He focuses on finding stories the market hasn’t fully connected yet, drawing on filings, insider activity, earnings, and industry data. His commentary has been quoted by U.S. News & World Report, Moneywise, and Yahoo Finance. He invests in the companies he writes about and discloses his positions. Nothing he publishes is investment advice.